This is the Final Report for the Engineering Practices (EP) Study of Proposed Changes to MIL-PRF-38535 for Mixed Date Codes and Multiple Date Codes on One (1) Certificate of Conformance.
Dated: 24 June 2008
File name: ep_prf38535h.pdf, File Size: 34 kb
Proposed Changes to MIL-PRF-38535 for Additional Requirements on Test Optimization Data
Dated: 15 October 2008
File name: prf38535EPStudy.pdf, File Size: 16 kb
Proposed Changes to MIL-PRF-38535 for Additional Requirements on Passive Elements.
Dated: 22 February 2010
File name: prf38535PassElmt.pdf, File Size: 21 kb
Proposed Changes to MIL-PRF-38535 Concerning Determination of New Technology Requirements in the Appendix H.
Dated: 02 March 2010
File name: prf38535_EPS_New_Tech.pdf, File Size: 19 kb
Proposed Changes to MIL-PRF-38535 Concerning Addition of Requirements for Internal Gas Analysis As A Process Monitor
Dated: 04 March 2010
File name: prf38535EPStudy_IGA.pdf, File Size: 16 kb
Proposed New Class Y (Non-Hermetic Microcircuits for Space Application) Requirements for MIL-PRF-38535
Dated: 24 February 2012
File name: prf38535EPStudyClassY.pdf, File Size: 284 kb
Final Report: Similar Screening, TCI/QCI and RHA Table Requirements of MIL-PRF-38535 and TM5004/5005 of MIL-STD-883.
Dated: 16 August 2012
File name: prf38535EPStudytables.pdf, File Size: 173 kb
Use of Base Metal Electrode (BME) Capacitors in QML Hybrid Microcircuits.
Dated: 26 September 2012
File name: prf38534EPStudy_BME.pdf, File Size: 19 kb
MIL-STD-883, Method 1014 Survey of Industry to Determine Which Test Conditions Are Being Used
Dated: 20 October 2014
File name: std883tm1014EPStudy.pdf, File Size: 98 kb
Proposed Changes to MIL-PRF-38535 Requirement of Laser Scribing for Die Separation From Wafer.
Dated: 06 November 2014
File name: eps38535laserscribing.pdf, File Size: 52 kb
Engineering Practice (EP) Study for Flip Chip Underfill Test Requirements to TM 5011 and MIL-PRF-38535.
Dated: 13 July 2015
File name: EPSprf38535tm5011.pdf, File Size: 405 kb
Engineering Practice (EP) Study for Standard Microcircuits Drawing (SMD) Burn-in Requirements.
Dated: 01 July 2016
File name: epsprf38535burn-in.pdf, File Size: 38 kb
Flip Chip Underfill and Thermal Interface Materials (TIM) Requirements to Propose Test Method TM 5011 of MIL-STD-883 and MIL-PRF-38353.
Dated: 15 August 2016
File name: epsprf3853final.pdf, File Size: 84 kb
Final Report for Engineering Practice (EP) study for preparation of a new class Y (ceramic non-hermetic flip chip BGA/CGA devices) Standard Microcircuit Drawings (SMD) boilerplate under MIL-PRF-38535.
Dated: 12 June 2017
File name: prf38535ClassYBoiler.pdf, File Size: 276 kb
Engineering Practice (EP) Study on Copper (Cu) wire bond test methodology development for microcircuit, hybrid and semiconductor devices.
Dated: 20 September 2017
File name: prf38535CuWireBond.pdf, File Size: 1172 kb
Re-write Radiation Hardness Assurance (RHA) requirements to Appendix C of MIL-PRF-38535.
Dated: 02 May 2017
File name: epsprf38535appc.pdf, File Size: 273 kb
Engineering Practice (EP) Study on proposed changes for electrostatic discharge (ESD)
requirements to MIL-PRF-38535.
Dated: 01 March 2017
File name: epsprf38535esd.pdf, File Size: 125 kb
High Frequency Microcircuit Devices Burn-in Clock Frequency Requirements Under MIL-PRF-38535.
Dated: 08 February 2018
File name: epsprf38535burnin.pdf, File Size: 103 kb
EP study on update of non-hermetic microcircuits class N (military, terrestrial and avionics
application) and class Y (Space application) to MIL-PRF-38535.
Dated: 23 October 2019
File name: epsprf38535class N_Y.pdf, File Size: 719 kb
Engineering Practice (EP) study for update of non-hermetic microcircuits class N military, avionics & terrestrial (also suitable for small satellite/space program) applications under MIL-PRF-38535.
Dated: 24 August 2020
File name: idepstudy38535.pdf, File Size: 415 kb
Evaluation and test requirements of Pb free bump for flip chip devices under MIL-PRF-38535
Dated: 01 May 2021
File name: epsprf38535pbfree.pdf, File Size: 398 kb
Ep Study of Non-Hermetic Microcircuit Class N Military, Avionics & Terrestrial (Also Suitable for Small Satellite/Space Program) applications under MIL-PRF-38535. (Phase 2
Dated: 05 March 2021
File name: epsprf38535final.pdf, File Size: 484 kb
the Purpose of This Engineering Practice (Ep) Study Is to Obtain Input/Feedback From the Military Services and DLA Land and Maritime concerning the viability of replacing MIL-HDBK-103 Parts I-III with a link to the online SMCR
Dated: 01 July 2022
File name: epshdbk103final.pdf, File Size: 18 kb
The purpose of this Engineering Practice (EP) Study is to obtain input/feedback from the military services, microcircuit manufacturers, package assembly houses and user communities regarding the allowance of bi-metallic bonds in class V, Y, and P devices under the MIL-PRF-38535 specification.
Dated: 27 March 2025
File name: epsprf38535_Bimetal.pdf, File Size: 200 kb
The purpose of this Engineering Practice (EP) Study is to obtain input/feedback from the microcircuits manufacturers, test laboratories, OEM, users, military services and space community members regarding IGA packaged related test under the MIL-PRF-38535 specification.
Dated: 26 November 2024
File name: prf38535eps_IGA.pdf, File Size: 397 kb
Determining the Potential Improvements to MIL-STD-883-5 Test Method 5011, Evaluation and Acceptance Procedures for Polymeric Materials
Dated: 27 November 2024
File name: epsstd8835011.pdf, File Size: 165 kb
The purpose of this Engineering Practice (EP) Study is to obtain input/feedback from the military services, manufacturers, users, and other stakeholders concerning the current usage and potential improvements to MILSTD-883-2 test method 2030, "Ultrasonic inspection of die attach"
Dated: 17 June 2026
File name: epsstd883-2_26-003.pdf, File Size: 870 kb
The purpose of this Engineering Practice (EP) Study is to obtain input/feedback from the military services, manufacturers, users, and other stakeholders concerning the current usage and potential improvements to MILSTD-883-2 test method 2009, "External Visual".
Dated: 15 June 2026
File name: epsstd883-2_26-005.pdf, File Size: 769 kb
The objective of this EP study is to obtain from the military services, device manufacturers, OEMs, and user community comments or concurrence regarding the proposed revision of test method 2011 of MIL-STD-883-2.
Dated: 17 July 2026
File name: idepsstd883-2_26-004.pdf, File Size: 1356 kb