Dated Engineering Practices (EP) Study on Conformance Testing for Small Die Bipolar Transistors.
Dated: 24 June 2003
File name: EPSB_C.doc, File Size: 193 kb
Final Report for Standardization on Soldering Heat Testing for Semiconductors
Dated: 27 October 2004
File name: epSolderHeatfinal.pdf, File Size: 729 kb
Dated Engineering Practices (EP) Study to Address: (Problems in the Standardization of Current and Power Ratings, Derating, and Maximum Operating Temperature)
Dated: 21 July 2004
File name: ep19500pwrratings.pdf, File Size: 235 kb
Final Report for Destructive Physical Analysis for Diodes and Transistors Under the MIL-PRF-19500 Program
Dated: 25 October 2004
File name: epDPAfinal.pdf, File Size: 1277 kb
Final Report on the Relevance of Delta VF Testing After Burn-in for JANTX/JANTXV Rectifier Devices for MIL-PRF-19500 Slash Sheets /411, /420, /427, and /429
Dated: 20 May 2011
File name: eps19500 delta vf.pdf, File Size: 28 kb
Review MIL-PRF-19500 Conformance Inspection for Ability to Detect Weakened Wire Bonds
Dated: 11 February 2011
File name: prf19500EPStudy.pdf, File Size: 84 kb
Engineering Practice Study to Review the Dimensions of the UA Case Outline.
Dated: 09 September 2011
File name: EPS1126UAcase outline.pdf, File Size: 268 kb
Engineering Practice Study to Review the Proposal to Add Displacement Damage to MIL-PRF-19500; General Specification for Semiconductor Devices, and Applicable Bipolar Transistor, Diode, and MOSFET Specification Sheets
Dated: 27 August 2012
File name: EPS1128dispdamage.docx, File Size: 72 kb
Engineering Practice Study to Establish Laser Marking Requirements for MIL-PRF-19500
Dated: 02 January 2013
File name: EPS 1127laser marking.pdf, File Size: 111 kb
Proposal to Add a Lead/Carrier Board Option for Surface Mount Devices in MIL-PRF-19500 Slash Sheets
Dated: 30 July 2015
File name: EPS1142LeadCarrier.pdf, File Size: 593 kb
Proposal to Add Part Numbers Containing A Lead Finish Designators in MIL-PRF-19500 Slash Sheets
Dated: 30 March 2016
File name: eps1141leadfinishpin.pdf, File Size: 50 kb
The study will determine if the existing step coverage requirements for MIL-PRF-19500 are sufficient or whether additional restrictions are needed for the type of equipment used for manufacturing specific wafer design types.
Dated: 26 August 2016
File name: epsprf19500tm1153.pdf, File Size: 23 kb
Engineering Practice Study to Review TA conditions for rectifier burn-in.
Dated: 09 September 2016
File name: EPS1155ReviewRect.docx, File Size: 61 kb
Engineering Practice Study to Review the Proposed Displacement Damage Format
Dated: 10 March 2017
File name: EPS1154DispDamage.pdf, File Size: 109 kb
Engineering Practice Study to review available surface mount package options for MIL-PRF-19500 specification sheets.
Dated: 06 January 2017
File name: eps1159SMPreview.zip, File Size: 132 kb
Survey to Standardize Retention Data Requirements for Multiple Commodities.
Dated: 13 July 2018
File name: EPS19500_Data_Reten.pdf, File Size: 57 kb
Study to Review Usage of Electroless Nickel Phosphide in Package Plating.
Dated: 13 July 2018
File name: EPS1161Elec_NiP_Plate.pdf, File Size: 61 kb
Study to Review Usage of GaN and SiC Devices in the Federal Stock Class 5961.
Dated: 13 July 2018
File name: EPS19500GaN_SiC.pdf, File Size: 12 kb
Engineering Practice Study to Review the Burn-in, Life test, and Safe Operating Area (SOA) Specification Sheet Format of Power Transistors.
Dated: 19 September 2018
File name: EPS19500transburnin.zip, File Size: 82 kb
Study to Review Step Coverage Requirements for Alternate Channel Metallization Designs.
Dated: 19 October 2018
File name: epsprf19500eps1164.pdf, File Size: 80 kb
Engineering Practice Study to Review the Burn-in, Life Test, and SOA Specification Sheet Format of Power Transistors
Dated: 24 June 2019
File name: eps19500burn_in.pdf, File Size: 206 kb