Design Center(s)
Location:Original Manufacturer
Line: Various
Flow: Various
Location:San Jose, CA
Line: Cypress
Flow: Cypress Design Rules
Mask Development Center(s)
Location:Original Manufacturer
Line: Various
Flow: Various
Wafer Fabrication Operation(s)
Location:Original IC Manufacturer
Line: Various
Flow: Various
Location:Bloomington, MN
Line: Cypress
Flow: R9 (90 Nanometer CMOS)
Location:Bloomington, MN
Line: Cypress
Flow: R9 (90 Nanometer CMOS)
Assembly Operation(s)
Location:Simi Valley, CA
Line: DPA Class Q SRAM
Flow: Standard DPA Components QML Flow DPA-OID-009
Location:Simi Valley, CA
Line: DPA Class V contract assemlby
Flow: Standard DPA Components QML Flow DPA-OID-009
Location:Milipitas, CA
Line: Alternate Tinning
Flow: QML Tinning procedure
Location:Milipitas, CA
Line: Golden Altos, Alternate Assembly
Flow: Standard Golden Altos QML Line, GAF 1491, 1492
Environmental Test Operation(s)
Location:Milipitas, CA
Line: Alternate Solderability
Flow: DSCC Approved Solerability Flow
Location:Simi Valley, CA
Line: DPA Environmental test
Flow: Standard DPA 883 Envoronmental Test Procedure
Package Information
| Type | Lead Range | Lead Finish | Lead Pitch |
| Can | 2-10 | solder/gold | |
| Chip Carrier J lead | 4-370 | solder/gold | |
| DIP | 8-48 | solder/gold | |
| Flatpack | 6-256 | solder/gold | |
| PGA | | solder/gold | |
| SOIC | 8-20 | solder | |
| SOJ | 20-26 | solder | |
| SSOP | 20-28 | solder | |
| Side-Braze | 8-64 | solder | |
| TSOPII | 44-54 | solder/gold | |