Qualification Part Search

Company Location Information

Company Level Information Micross Components (CAGE Code:57300)
1810 South Orange Blossom Trail, Apopka, FL, 32703, US

Company Contact: Ms. Steven White,Phone: 813-892-1998,Fax:
Land and Maritime Contact:Phone: 614-692-1766, Fax: 614-693-1658, E-mail: vqh.jms@dla.mil

Quality Management (QM) Program:TRB
Periodic Inspection System:Option 1
ISO 9000 System:

Technologies:DC/DC Converters,Memory

Apopka (FL) Line

Class Level Information See Note 6/ Classes: Class H, Class E

Qualification Letters: VQ(VQH-24-038467),VQ(VQH-25-039558)

Substrate Fabrication Information See Note 1/ Substrate Fabrication Flows:
Substrate Fabrication: Purchased Ceramic Co-fire

Assembly Information See Note 1/ Assembly Flows: MCO-Q-1-2,AS8F512K32PG
Substrate Attach: Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach: Eutectic,Nonconductive Epoxy,RTV,Elastomer,Conductive Epoxy,Solder
Add-on Elements: Tabs,Inductors,Copper Wires,Unpackaged Die,Chip Capacitors,Chip Resistors,Stacked Capacitors,Terminals,Transformers,Flex Circuits,Tantalum Capacitor
Wire Bonding: Gold,Aluminum

Package Information See Note 1/ 2/ 3/ Packages: Ceramic Co-fire Package, Pin Grid Array, Seam Weld, 4.30 Seal Perimeter, 66 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 8 Seal Perimeter, 12 Leads, Gold Lead Finish

Microchip Technology (Thailand) Co., Ltd.

Class Level Information See Note 6/ Classes: Class H, Class E

Qualification Letters: VQ(VQH-18-032109),VQH-20-035487,VQ(VQH-17-031290),VQ(VQH-17-031169),VQ(VQH-17-031114)

Substrate Fabrication Information See Note 1/ Substrate Fabrication Flows: N/A
Substrate Fabrication: Purchased Ceramic Co-fire

Assembly Information See Note 1/ Assembly Flows: AS8S512K32QFP,AS8F128K32Q1,AS8S128K32PN-SAD
Substrate Attach: Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach: Nonconductive Epoxy,Conductive Epoxy
Add-on Elements: Unpackaged Die,Chip Capacitors
Wire Bonding: Aluminum

Package Information See Note 1/ 2/ 3/ Packages: Ceramic Co-fire Package, Pin Grid Array, Seam Weld, 4.06 Seal Perimeter, 66 Leads, Gold Lead Finish; Ceramic Co-fire Package, Quad Flat Pack, Seam Weld, 3.32 Seal Perimeter, 68 Leads, Gold Lead Finish

Notes

Notes:

1/ The QML listing can be expanded provided appropriate qualification testing is performed and passed. Therefore the manufacturer may accept an order for compliant product not covered by his QML listing, but shall not ship the compliant product until the testing has been successfully completed.

2/ Package seal perimeter is listed by largest perimeter successfully tested in inches.

3/ Package lead counts are listed by maximum number of leads covered by qualification.

6/ Class E devices are devices, which meet all of the requirements of one of the other classes (K, H, or G), with some exceptions taken. Therefore any manufacturer qualified to G, H or K is eligible to produce and mark product as compliant to class E.