Design Center(s)
Location:Plymouth, MN
Line: SOI IV(Q & V), SOI IVE(Q & V), SOI V (Q & V), S150 (V), MRAM
Flow: GMS 10022
Mask Development Center(s)
Location:Plymouth, MN
Line: SOI IV (Q & V), SOI IVE(Q & V), SOI V (Q & V), S150 (V), MRAM
Flow: GMS 10027
Wafer Fabrication Operation(s)
Location:NXP (Chandler, AZ and Austin, TX) NC
Line: Wafer Bumps (Residual Inventory Only)
Flow: 22027391
Location:Micross AIT, Durham NC
Line: Wafer Bumps
Flow: 58038518
Location:Plymouth, MN
Line: SOI IV (Q & V), SOI IVE(Q & V), SOI V (Q & V), S150 (V), MRAM
Flow: 22017935 (SOI IV), 22019135 (SOI IVe), 22020920 (SOI V), 22025794 (S150)
Location:Chandler, AZ
Line: MRAM
Flow: 22031906-SD, 58035282-SD
Assembly Operation(s)
Location:Plymouth, MN
Line: SOI IV (Q & V), SOI IVE(Q & V), SOI V (Q & V), S150 (V), MRAM
Flow: 22009590(SCP), 22021691(MCMs)
Location:Kyocera, San Diego, CA
Line: Non-hermetic Flip Chip
Flow: 22028780
Location:Six Sigma, Milpitas, CA
Line: Column Attach (Q & V)
Flow: PR-2010
Electrical Test Operation(s)
Location:Plymouth, MN
Line: SOI IV (Q & V), SOI IVE(Q & V), SOI V (Q & V), S150 (V), MRAM
Flow: GMS 10006
Environmental Test Operation(s)
Location:Six Sigma, Milpitas, CA
Line: Test Services
Flow: TS-2001
Location:Plymouth, MN
Line: SOI IV (Q & V), SOI IVE(Q & V), SOI V (Q & V), S150 (V), MRAM
Flow: GMS 10006
Package Information
| Type | Lead Range | Lead Finish | Lead Pitch |
| CGA | 783 Max | solder | 40-50 mil |
| DBGA/LGA | 783 Max | solder balls/Au | 40-50 mil |
| DIP | 24-28 | gold | 100 mil |
| Flatpack | 28-352 | gold | 20-50 mil |
| Flip Chip | 1761 Max | gold | |
| Pin Grid Array | 128 Max | gold | 100 mil |