Defense Logistics Agency DLA logo and Link to DLA website DLA logo and Link to DLA website DEFENSE LOGISTICS AGENCY DLA Weapons Support Qualification Part Search REVIEW

Company Location Information

Qualify System Information Texas Instruments SVA (formerly National Semiconductor) Leave DSCC
2900 Semiconductor Drive
Santa Clara,CA


CAGE Code: 27014, Symbol Code: CCXP
Company Contact: Valerie Vidal,Phone: (408) 721-3509,Fax:
Land and Maritime Contact:Phone: (614) 693-0176, Fax: (614) 693-1657, E-mail: vqc.ksy@dla.mil


QML Status:Full QML Certification/Qualification
Radiation Hardness Level:30-300 K
Class:Q & V

Design Center(s)

Location:TISVA, Arlington, TX (Die Bank)
Line: TISVA Design Rules
Flow: Q and V


Location:TISVA, Santa Clara, CA
Line: TISVA Design Rules
Flow: Q and V


Location:TISVA, Furstenfeldbruck, Germany
Line: TISVA Design Rules
Flow: Q and V


Location:TISVA, Greenock, Scotland
Line: TISVA Design Rules
Flow: Q and V


Location:TISVA, Takada, Japan
Line: TISVA Design Rules
Flow: Q and V

Mask Development Center(s)

Location:Photronics, Danbury, CT
Line: TISVA Specific
Flow: Q and V


Location:Dupont, Santa Clara, CA
Line: TISVA Specific
Flow: Q and V


Location:Dupont, Rousett, France
Line: TISVA Specific
Flow: Q and V

Wafer Fabrication Operation(s)

Location:TISVA, South Portland, ME
Line: 8" CMOS 7, CMOS 8, CMOS 9
Flow: Q and V


Location:TISVA, Arlington, TX (Die Bank)
Line: 6" (BiPolar and CMOS)
Flow: Q and V


Location:Quality Backgrind and Backmetal Service, Santa Clara, CA
Line: Wafer Thinning
Flow: Selected analog parts (Q and V)


Location:TISVA, Greenock, Scotland
Line: Fab 3, 6" (BiPolar and CMOS)
Flow: Q and V


Location:Scientific Coating Lab, Santa Clara, CA
Line: Wafer Backside Gold
Flow: Selected analog parts (Q and V)


Location:Taiwan Semiconductor Manuf. Co., Hsin-Chu, Taiwan
Line: 8" (BiPolar and CMOS)
Flow: Q only

Assembly Operation(s)

Location:Team Pacific, FTI Complex, Taguig, Philippines
Line: TO Metal Can, with selected screen tests (no burn-in)
Flow: Q only


Location:TISVA Melaka, Malaysia
Line: Wafer Thinning
Flow: Selected analog parts (Q and V)


Location:Amkor Technology, site P1, Muntinlupa City, Philippines
Line: Ceramic, with selected screen tests (no burn-in)
Flow: Q and V


Location:Golden Altos, Milpitas CA
Line: TO Metal Can, wth selected screen tests (no burn-in)
Flow: V


Location:Millennium Microtech, Bangkok, Thailand
Line: Ceramic, with selected screen tests (no burn-in)
Flow: Q and V


Location:Golden Altos, Milpitas CA
Line: high pin count ceramics, with selected screen tests (no burn-in)
Flow: Q and V

Electrical Test Operation(s)

Location:TISVA, Santa Clara, CA
Line: Electrical Test
Flow: Q and V


Location:TISVA Melaka, Malaysia
Line: Electrical Test
Flow: Q and V

Environmental Test Operation(s)

Location:Aeroflex RAD, Colorado Springs, CO
Line: Ionizing Radiation (Low Dose)
Flow: Q and V


Location:Golden Altos, Milpitas CA
Line: Group B, D
Flow: Q and V


Location:TISVA, South Portland, ME
Line: Ionizing Radiation (Total Dose)
Flow: Q and V


Location:TISVA, Santa Clara, CA
Line: Burn-In, Life Test, Ionizing Radiation (Total Dose)
Flow: Q and V


Location:contact manufacturer
Line: Burn-In, Life Test
Flow: Q and V


Location:White Sands Missile Range, New Mexico
Line: Ionizing Radiation (Low Dose)
Flow: Q and V


Location:TISVA Melaka, Malaysia
Line: Group B, D
Flow: Q and V

Package Information

TypeLead RangeLead FinishLead Pitch
CerDip (glass seal)8, 14, 16solder100 mil
CerPack (glass seal)10, 14, 16, 20solder50 mil
Leadless Chip Carrier20, 28solder50 mil
Other Cans2, 3, 8, 10solder100 and 200 mil
PGA gold100 mil
Quad CerPack - Gull Wing128gold20 mil
Quad Cerpack48, 68gold25 and 50 mil
S/Brazed DIP14, 24solder100 mil
SOIC10, 14, 16solder50 mil
TO-3 Can2solder430 mil