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Company Location Information

Company Level Information Spectrum Control, Inc. (CAGE Code:07180)
400 Nickerson Road, Marlborough, MA, 01752-4717, US

Company Contact: Mr. Johanny Rojas,Phone: (774) 405-7638,Fax: (508) 251-6401
Land and Maritime Contact:Phone: 445-737-2725, Fax: 614-693-1658, E-mail: vqh.sp@dla.mil


Quality Management (QM) Program:Non-TRB
Periodic Inspection System:Options 1 and 2
ISO 9000 System:

Technologies:Analog,Direct Bond Copper Hybrid,Low Power,Voltage Reference,Data Converters,Track and Hold Amp


Millenium Microtech Thailand Plant
Class Level Information See Note 6/ Classes: Class H

Qualification Letters: VQ(VQH-16-030502)


Substrate Fabrication Information See Note 1/ Substrate Fabrication Flows: 5366-10
Substrate Fabrication: Thin Film on Alumina, 2 Conductor Level(s), Resistors


Assembly Information See Note 1/ Assembly Flows: 5366-2
Substrate Attach: Non-conductive Epoxy
Element Attach: Conductive Epoxy
Add-on Elements: Unpackaged Die,Chip Resistors
Wire Bonding: Gold


Package Information See Note 1/ 2/ 3/ Packages: Metal Package, TO Can, Projection Weld, 1.16 Seal Perimeter, 8 Leads, Gold Lead Finish


Marlborough Plant
Class Level Information See Note 6/ Classes: Class K, Class H, Class E

Qualification Letters: EQ(EQC-92-062),VQ(VQH-99-0204),VQ(VQH-01-0102),ELS(ELSH-94-0254),EQ(EQC-94-008),VQ(VQH-06-010485),VQ(VQH-08-014380),EQ(EQC-91-894),VQ(VQH-01-0104),VQ(VQH-04-004898),VQ(VQH-07-013689),VQ(VQH-99-0176),VQ(VQH-98-0177),VQ(VQH-98-0232),EQ(EQC-93-162),ELS(ELSH-94-0252),ELS(ELSH-95-0269),VQ(VQH-04-005172),VQ(VQH-06-011842),EQ(EQC-91-235),ELS(ELSH-95-0183),EQ(EQC-89-421),EQ(EQM-88-0709),ELS(ELSH-94-0253),VQ(VQH-03-004619)


Substrate Fabrication Information See Note 1/ Substrate Fabrication Flows: 52-0059
Substrate Fabrication: Thin Film on Beryllia, 1 Conductor Level(s); Ceramic Co-fire; Thin Film on Alumina, 1 Conductor Level(s); Purchased Thick Film on Alumina, 5 Conductor Level(s); Purchased Direct Bonded Copper on Alumina Nitride, 2 Conductor Level(s)


Assembly Information See Note 1/ Assembly Flows: FC-25,12-0902
Substrate Attach: Nonconductive Epoxy,Solder
Element Attach: Eutectic,Nonconductive Epoxy,Conductive Epoxy,Solder
Add-on Elements: Unpackaged Die,Chip Resistors,Chip Capacitors
Wire Bonding: Gold,Aluminum


Package Information See Note 1/ 2/ 3/ Packages: Copper Package, Single-in-line, Seam Weld, 4.90 Seal Perimeter, 17 Leads, Nickel Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 7.48 Seal Perimeter, 62 Leads, Gold/Solder Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 2.57 Seal Perimeter, 14 Leads, Gold Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 6.20 Seal Perimeter, 136 Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld, 1.65 Seal Perimeter, 12 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Seam Weld, 1.62 Seal Perimeter, 28 Leads, Solder Lead Finish; Metal Package, TO can, Projection Weld, 6 Seal Perimeter, 12 Leads, Nickel Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal, 1.13 Seal Perimeter, 22 Leads, Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 3.58 Seal Perimeter, 16 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Single-in-line, Seam Weld, 2.90 Seal Perimeter, 10 Leads, Gold Lead Finish


Notes

Notes:

1/ The QML listing can be expanded provided appropriate qualification testing is performed and passed. Therefore the manufacturer may accept an order for compliant product not covered by his QML listing, but shall not ship the compliant product until the testing has been successfully completed.

2/ Package seal perimeter is listed by largest perimeter successfully tested in inches.

3/ Package lead counts are listed by maximum number of leads covered by qualification.

6/ Class E devices are devices, which meet all of the requirements of one of the other classes (K, H, or G), with some exceptions taken. Therefore any manufacturer qualified to G, H or K is eligible to produce and mark product as compliant to class E.