Qualification Part Search

Company Location Information

Company Level Information Lockheed Martin Missiles and Fire Control (CAGE Code:04939)
5600 Sand Lake Road MP189, Orlando, FL, 32819-8907, US

Company Contact: Mr. Christopher Adams,Phone: 407-356-0512,Fax: 407-356-6808
Land and Maritime Contact:Phone: 614-692-9549, Fax: 614-693-1658, E-mail: vqh.sk@dla.mil

Quality Management (QM) Program:TRB
Periodic Inspection System:Option 1
ISO 9000 System:

Technologies:Analog,Digital

Class Level Information See Note 6/ Classes: Class D

Qualification Letters: VQ(VQH-12-024704)

Substrate Fabrication Information See Note 1/ Substrate Fabrication Flows: N/A
Substrate Fabrication: Purchased Thick Film

Assembly Information See Note 1/ Assembly Flows: 861 Process Flow
Substrate Attach: Solder
Element Attach: Conductive Epoxy
Add-on Elements: Unpackaged Die,Chip Capacitors
Wire Bonding: Gold

Package Information See Note 1/ 2/ 3/ Packages: Metal Package, Axial Leads, Projection Weld, 1.88 Seal Perimeter, 16 Leads, Gold Lead Finish

Class Level Information See Note 6/ Classes: Class H, Class E

Qualification Letters: EQ(EQC-92-412),EQ(EQC-91-764),VQ(VQH-99-0164),EQ(EQC-92-112),EQ(EQC-92-312),VQ(VQH-10-020356),EQ(EQC-91-402)

Substrate Fabrication Information See Note 1/ Substrate Fabrication Flows: N/A
Substrate Fabrication: Purchased Thick Film

Assembly Information See Note 1/ Assembly Flows: 72301772
Substrate Attach: Nonconductive Epoxy
Element Attach: Eutectic,Nonconductive Epoxy,Conductive Epoxy
Add-on Elements: Inductors,Tantalum Capacitors,Unpackaged Die,Chip Capacitors,Chip Resistors
Wire Bonding: Gold,Aluminum

Package Information See Note 1/ 2/ 3/ Packages: Ceramic Package, Leadless Chip Carrier, Solder Seal, 3.80 Seal Perimeter, 68 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 11.80 Seal Perimeter, 140 Leads, Gold Lead Finish; Metal Package, Platform, Projection Weld, 5.76 Seal Perimeter, 44 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Solder Seal, 2.88 Seal Perimeter, 18 Leads, Gold/Solder Lead Finish

Notes

Notes:

1/ The QML listing can be expanded provided appropriate qualification testing is performed and passed. Therefore the manufacturer may accept an order for compliant product not covered by his QML listing, but shall not ship the compliant product until the testing has been successfully completed.

2/ Package seal perimeter is listed by largest perimeter successfully tested in inches.

3/ Package lead counts are listed by maximum number of leads covered by qualification.

6/ Class E devices are devices, which meet all of the requirements of one of the other classes (K, H, or G), with some exceptions taken. Therefore any manufacturer qualified to G, H or K is eligible to produce and mark product as compliant to class E.