Heat Sinks, Semiconductor Devices, General Specification for (Cancellation Notice)
Dated: 20 November 2000
File name: mil87111not2.pdf, File Size: 4 kb
Heat Sinks-Insulators, Class 1, 4, 6, and 7 (Wafer Type) (Cancellation Notice)
Dated: 20 November 2000
File name: mil87111ss1not2.pdf, File Size: 7 kb
Heat Sinks, Seniconductor Devices, Material Classes 2, 3, and 5 (Retainer Clip Type) <br>(Cancellation Notice)
Dated: 20 November 2000
File name: mil87111ss2not2.pdf, File Size: 6 kb
Heat Sinks, Electrical-Electronic Component Class 1 and Class 2 (Press-on Type) <br>(Cancellation Notice)
Dated: 20 November 2000
File name: mil87111ss3not2.pdf, File Size: 6 kb
Heat Sink, Semiconductor Devices, Class 1 (Encapsulating Type) (Cancellation Notice)
Dated: 20 November 2000
File name: mil87111ss4not2.pdf, File Size: 5 kb
Heat Sinks, Electrical-Electronic Component, Semiconductor Device, Class 1 (Formed) (Cancellation Notice)
Dated: 20 November 2000
File name: mil87111ss5not2.pdf, File Size: 4 kb
Heat Sinks, Semiconductor Devices, Class 1 (Extruded) (Cancellation Notice)
Dated: 20 November 2000
File name: mil87111ss6not2.pdf, File Size: 6 kb
Heat Sinks, Semiconductor Devices, Class 1, (for Dual-in-Line Packages) (Cancellation Notice)
Dated: 20 November 2000
File name: mil87111ss7not2.pdf, File Size: 6 kb
Heat Sinks, Semiconductor Devices, Class 2 (Dual Link) (Cancellation Notice)
Dated: 20 November 2000
File name: mil87111ss8not2.pdf, File Size: 5 kb